The UK Microsystems Network, organised by the Packaging and Integration SIG, will be hosting an event on Wednesday 10th June at the University of Southampton on the Advanced Packaging and Heterogeneous Integration.
Advanced packaging and heterogeneous integration are rapidly becoming the defining challenge for next-generation microelectronics. As global competition intensifies and the limits of traditional scaling are reached, the UK’s ability to develop, adopt and commercialise these technologies has never been more important.
This free one-day workshop brings together leading voices from UK industry, national facilities, innovation centres and academia to take stock of where we are, what the UK supply chain can offer, and what needs to happen next.
Full agenda below – check back for updates:
Agenda
09:00 Registration and Coffee
09:45 Welcome and Introduction – Ibrahim Sari, University of Southampton
09:50 Gerard Cummins, UK Microsystems Network, Introduction to the Network and the Packaging & Integration SIG
10:00 Feras Alkhalil, Pragmatic Semiconductors, Advancing Semiconductor Sustainability with Low-Carbon FlexIC Technology
10:25 John Lipp, STFC Interconnect, Advanced Packaging Techniques Applied to Assembling Scientific Instruments
10:50 Coffee Break
11:15 Andrew Robertson, Bay Photonics, Advanced Packaging Technologies for Semiconductor Quantum Photonic Devices
11:40 Jeff Kettle, University of Glasgow, Additive Manufacturing of Advanced Heterogenous Packages, University of Glasgow
12:05 Suzanne Costello, Forensic Eyes Ltd., Forensics Before Failure: A Proactive Approach to Package Reliability
12:30 Networking Lunch
13:10 Jay Chandrappan, CSA Catapult, Advanced Packaging : System Level Enabler for UK Semiconductor Innovation
13:35 Derrick Holliday, University of Strathclyde, NASPIC: Advanced Packaging for Power Electronics and Photonics
14:00 Stephen Riches, IMAPS-UK, Challenges for Implementing AP/HI for Microsystem Assembly and How IMAPS-UK Can Provide Guidance
14:25 Charles Sturman, TechWorks, UK Advanced Packaging Industry Landscape
14:50 Coffee Break
15:15 Colin Mitchell, Optoelectronics Research Centre, University of Southampton, Optical hybrid integration for environmental and medical sensing in the mid-infrared
15:40 John Darlington, CHIMES IKC, Innovation and Knowledge Centre in Heterogeneous Integrated Micro Electronic and Semiconductor Systems
16:05 Lloyd Peto, NanoScope Services Ltd., Reliability Testing and Failure Analysis for Advanced Packaging
16:30 Closing Remarks – Ibrahim Sari, University of Southampton
16:35 – 18:00 Pizza and drinks reception
This event offers a professional forum for knowledge exchange between industry leaders, trade associations, innovation centres and researchers, and is free to attend.
If you are interested in attending this event you can register here.
Venue: University of Southampton, Highfield Campus, Building 100, Level 6, University Road, Southampton, SO17 1BJ
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